AI-Native Design and Manufacturing of Micron-Precision Interconnects Integrated with Advanced Semiconductor Packaging Technologies

Helix develops physics-based AI models—trained on proprietary micron-scale design and manufacturing datasets—to integrate high-density interconnects (HDI), high-speed interconnects (HSI), and advanced packaging structures into a unified Chip-on-Wafer-on-Platform (CoWoP) architecture. By removing the organic substrate required in CoWoS, this AI-optimized platform enables dramatically shorter electrical paths, higher bandwidth density, and substantial improvements in energy efficiency for next-generation AI compute.

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AI Data Centers. Advanced Packaging. World-Class HDI.

Capabilities

Multi-physics AI optimization across electromagnetic, thermal, mechanical, and materials domains
AI-driven HDI stack-up, layer architecture, routing, impedance control, and manufacturability/yield optimization
40+ layer HDI and 224 Gb/s+ HSI design, simulation, and manufacturing
SAP/mSAP, ABF buildup, and semiconductor-grade advanced packaging process integration
Autonomous manufacturing environments with AI copilots for real-time process and quality control
CoWoP platform design, system integration, and validation for next-generation AI modules
Real-time multimodal sensing, adaptive control, and closed-loop optimization for consistent high-volume yield

Helix Systems Footprint

Helix Systems is headquartered in the United States, where our AI talent, R&D leaders, and executive team drive innovation in advanced HDI and semiconductor packaging technologies. Our California-based operations house our cutting-edge AI research, product development, and strategic partnerships that enable next-generation computing solutions for AI data centers and high-performance applications.