Solutions for AI Data Centers
Purpose-built components for demanding AI workloads and high-performance computing
GPU & AI Accelerator Substrates
Advanced IC substrates and HDI solutions for NVIDIA, AMD, and custom AI accelerators. Engineered for extreme power delivery and high-speed signaling requirements.
CoWoP & CoWoS Packaging
Chip-on-Wafer-on-Package and Chip-on-Wafer-on-Substrate solutions for 2.5D/3D heterogeneous integration, enabling HBM integration and chiplet architectures.
Silicon Photonics & CPO
Co-packaged optics substrates for next-generation AI networking. Ultra-fine-line HDI and mSAP technologies for high-bandwidth optical interconnects.
Technical Capabilities
Ultra-high-density interconnects (>10,000 I/O)
Advanced thermal management solutions
High-power delivery networks (>1000A)
mSAP ultra-fine-line processing (<25μm)
Glass substrate technology
Fan-out wafer-level packaging (FOWLP)
Panel-level advanced packaging
2.5D/3D integration expertise
AI-optimized process control