Advanced Packaging Technologies
Industry-leading expertise in next-generation semiconductor packaging
CoWoP & CoWoS Solutions
Chip-on-Wafer-on-Package and Chip-on-Wafer-on-Substrate technologies for 2.5D/3D heterogeneous integration. Enabling HBM, chiplet architectures, and advanced multi-die systems.
mSAP & Ultra-Fine-Line HDI
Modified Semi-Additive Process technology for ultra-fine-line (<25μm) HDI. Critical for high-speed signaling, dense I/O, and next-generation AI accelerators.
Glass Substrates & Advanced IC Carriers
Next-generation glass substrate technology for improved signal integrity and power delivery. Custom IC carriers engineered for demanding thermal and electrical requirements.
Applications
AI & High-Performance Computing
- AI accelerator packaging (NVIDIA, AMD, custom ASICs)
- GPU modules with HBM integration
- High-performance server processors
Networking & Communications
- Silicon photonics for co-packaged optics (CPO)
- High-speed network switches and routers
- 400G/800G+ optical transceivers
Advanced Chiplet Integration
- Multi-die heterogeneous integration
- UCIe (Universal Chiplet Interconnect Express)
- Fan-out wafer-level packaging (FOWLP)
Emerging Technologies
- Quantum computing interconnects
- Neuromorphic computing substrates
- Edge AI processors