Leadership Team

Helix's team combines Silicon Valley AI expertise with Taiwan's world-class HDI and semiconductor packaging capabilities to deliver advanced IC substrates, CoWoP/CoWoS packaging, and components for AI data centers and high-performance computing.

John-Paul Ho

CEO (U.S.)

Founder & Managing Partner, Crimson Capital (U.S.–Asia VC/PE; offices in Silicon Valley, Tokyo, Taipei, Shanghai, Singapore).
McKinsey Award for cross-border manufacturing; named a ‘Leading Investor in Asia’ by Time.
Built/invested in component makers serving Apple, Dell, Cisco, Sony, Samsung, Toshiba, Tesla, Medtronic, Agilent, ABB, GE; founded Omni (ASEAN electronics manufacturer; customers HP, Dell) and Ascent (software-driven, asset-light ASEAN supply chain/logistics; customers HP, Dell).
First Boston: Head of M&A Asia (ex-Japan); advised ASE (Nvidia AI GPU supplier) and Samsung; Toshiba Malaysia build-operate-transfer model. Goldman Sachs M&A (NY).
Government advisor to Taiwan and Singapore on upgrading to tech-intensive economies.
Research focus: robotics and human motion, globally competitive manufacturing, AI/medical applications, Lean/Six Sigma, Japanese quality.
Education: Harvard A.B. Engineering/Applied Math (decision & control), summa cum laude; Harvard MBA (Dean’s Doctoral selection); Harvard Medical School studies.

Kevin Kan

Senior Executive Vice President

  • Former Foxconn SVP, C-suite executive, and board director.
  • Built Apple/mobile division from 0 to $12B revenue and ~120k employees; scaled to $30B with headcount held roughly flat via factory automation.
  • Ran manufacturing across 10 countries; built Foxconn’s first autonomous ‘dark’ factory.
  • B.S. Mechanical Engineering (Taiwan educated).

Dr. David Wang

Chairman (U.S.)

  • Applied Materials EVP: grew international sales from $1B to $10B in seven years; led industry-dominant semiconductor equipment roadmap.
  • Smithsonian added his Precision 5000 plasma etch system to its permanent collection alongside Apollo 11 and Shuttle Discovery.
  • Bell Labs: 100 semiconductor manufacturing patents generating $1B in licensing revenue.
  • Ph.D. Materials Science, UC Berkeley.

Dr. Sam Liang

Senior Vice President (U.S./Taiwan)

  • Foxconn Senior Director: built operations and proprietary factory automation across China, Europe, and Latin America; won $500M Nokia business.
  • Wistron C-suite leader: built U.S. manufacturing operations.
  • Blackstone portfolio GM: launched Mexico manufacturing operations.
  • Led operations across the U.S., Europe, China, ASEAN, and South Asia; managed 10 factories and 20,000 employees.
  • Ph.D. Materials Science (U.S. educated); holder of four manufacturing process patents.

Dr. Richard Pon

Advisor

  • W-Con Electrical: high-speed interconnects for Nvidia AI data servers.
  • SpeedTech CTO: co-developed Tesla power connector, SpaceX communication connector, Intel data server high-speed connector; Intel & AMD CPU/GPU connectors.
  • Won Apple, Cisco switching, and Samsung programs at prior connector roles.
  • FCI International Connector Work Group representative alongside Intel, Molex, Tyco, TI, Elpida, Infineon, IBM, and HP.
  • Ph.D. Applied Mechanics (U.S.); roughly 30 connector patents.

Jesse Chen

Advisor (U.S.)

  • Dell Head of Asia Supply Chain: $30B annual spend; $5.5B Asia P&L cash flow; managed ~100 suppliers and 20 Dell factories worldwide.
  • DJO Global (Blackstone portfolio) SVP: oversaw $500M annual medical device spend.
  • Jabil Circuit Managing Director: built Asian manufacturing operations.
  • B.S. Computer Science (U.S. educated).

Jacob Goldfield

Investor & Senior Advisor

  • Former CIO, Soros Management (Quantum Fund).
  • Former Senior Partner and Management Committee member, Goldman Sachs (risk and arbitrage proprietary trading).
  • Former Harvard Management Company board member.
  • Early investor in Ramp, Cognition, Long Lake; co-founded CombinatoRx; Sequenta board member; Trustee, Cold Spring Harbor Laboratory.

Helix's HDI Team from Taiwan

World-class experts in HDI, multi-layer PCB, IC substrate, and advanced packaging technologies.

James Ni

HDI TEAM

  • Former leader at TSMC, Kinsus (major substrate supplier to Apple, NVIDIA, Broadcom), and AaltoSemi (BT/ABF substrates for global semiconductor customers).
  • Built and scaled multiple BT/ABF and coreless HDI substrate factories; led Industry 4.0 automation and AMHS deployment.
  • Directed new-fab construction, factory layout, capacity modeling, and end-to-end substrate operations.
  • Expert in high-layer HDI, substrate packaging, supply chain integration, and smart-factory systems.
  • Master’s degree, National Tsing Hua University.

Alex Lee

HDI TEAM

  • Former senior engineer at Unimicron (#1 substrate supplier to NVIDIA, Intel, Apple) and process lead at Dynamic Electronics (serving global networking and server OEMs).
  • Specialist in HDI lamination, multi-layer AI server boards, mSAP, 5G materials, and 40-layer stack-ups.
  • Drove yield optimization for automotive, radar, server, and high-density PCB programs across multiple fabs.
  • Extensive experience integrating new materials, copper foils, brown oxide systems, and factory-side reliability improvements.
  • Master’s degree, Tatung University.

Jones Lin

HDI TEAM

  • Engineering leader at TSMC, Unimicron (#1 substrate supplier to NVIDIA, Intel, Apple), Kinsus, and Xintec (WLCSP for global fabless customers).
  • Led 8" and 12" WLCSP process development, multilayer substrate integration, and factory build-out programs.
  • Deep expertise across photolithography, electroplating, diffusion, etching, thin-film deposition, and backend packaging.
  • Managed large cross-functional teams across R&D, PE, production, and factory integration.
  • Master’s degree, National Central University.

Allen Huang

HDI TEAM

  • Senior leader at Unimicron (#1 substrate supplier to NVIDIA, Intel, Apple), STATS ChipPAC (OSAT for Qualcomm, Broadcom, MediaTek), Nan Ya PCB, and TSMC.
  • Built Unimicron’s first ABF FC-BGA fab; qualified platforms for leading AI, CPU, and networking customers.
  • Led substrate platform development (MLC, multicore, embedded trace, large-body carriers) and factory expansions.
  • Directed major NPI programs, advanced substrate RDL/FOPLP/TGV development, and VIP customer integration.
  • Master’s degree, National Central University.

Dr. David Tarng

HDI TEAM

  • Former corporate R&D director at ASE Group (serving NVIDIA, AMD, Apple, Qualcomm), and senior leader at Hitachi Via Mechanics, Atotech, and COMPEQ.
  • Led advanced substrate materials, chiplet integration, FOCoS panel-level packaging, and 2.1D/2.5D interposer technologies.
  • Built cross-site R&D centers and directed chemical, materials, FA, thermal, and stress-analysis laboratories.
  • 20+ patents and 40+ technical publications in major packaging conferences.
  • Ph.D. in Chemical Engineering.

Albert Fu

HDI TEAM

  • Senior manager at Avary (largest PCB manufacturer serving Apple, Cisco, Huawei) and Unimicron (supplier to NVIDIA, Intel, and high-performance computing customers).
  • Led startup and ramp of HDI and mSAP factories (2,000+ pnl/day and 2,200 pnl/day capacities).
  • Managed 20–800 personnel across R&D, PE, NPI, product engineering, and high-volume manufacturing.
  • Expert in HDI, FCCSP, FCBGA, yield engineering, and process platform standardization.
  • Master’s degree, National Tsing Hua University.

Helix's Advisory Board

Strategic advisors with deep expertise in technology, finance, and semiconductors.

Drew Peck

Senior Technology Advisor

  • MIT Lincoln Laboratory: Quantum Electronics Group.
  • Managing Director of DLJ's semiconductor equity research team. Selected multiple times for Institutional Investor All-America Research Team, including #1 ranking.
  • Partner at Crimson Capital. Led semiconductor investment group. Board member of numerous public and private deep tech companies.
  • Brandeis University, B.A. in Physics. MIT, M.S. degree in Management and Electrical Engineering.

Jacob Goldfield

Senior Advisor, Founding Investor in Helix

  • Former Senior Partner and Management Committee member of Goldman Sachs, Risk and Arbitrage Proprietary Trading.
  • Former Chief Investment Officer of Soros Management (Quantum Fund).
  • Former Harvard Management Corporation Board of Directors.
  • Managing Director, JG Fund Family Office. Early Investor in Ramp, Cognition, Long Lake Management Holdings.
  • Trustee, Cold Springs Harbor. Harvard College, B.A. in Physics.

Dr. Jiang Yi

Senior Advisor

  • Former TSMC Co-COO and Senior VP of R&D. Built R&D organization from 148 to 5,500. Developed and oversaw volume of production for CoWoS. Key manufacturing technology responsible for modern AI compute.
  • Board of Directors of Foxconn.
  • TSMC technology liaison to ASML.
  • Intel Technological Advisory Board.
  • Ph.D. Stanford, IEEE Fellow.