AI Technologies for Advanced Interconnects and Packaging
Physics-based AI, digital twins, and multimodal sensing powering CoWoP architectures and next-generation AI modules.
Physics-Based AI Platform
Our AI platform learns from proprietary micron-scale datasets to co-optimize HDI/HSI interconnects and advanced packaging structures in a unified design flow.
By integrating multi-physics simulation, digital twins, and adaptive control, we enable CoWoP architectures with shorter electrical paths, higher bandwidth density, and improved energy efficiency.
AI Platform Capabilities
AI-native design for interconnect and advanced packaging
From multi-physics AI engines to sensor fusion and digital twins, our platform accelerates CoWoP and next-generation AI modules.
Physics-Based AI Engines
Multi-physics AI integrating electromagnetic, thermal, mechanical, and materials domains to co-optimize interconnect and packaging performance.
AI Digital Twins
High-fidelity digital twins trained on proprietary micron-scale datasets for HDI/HSI stack-ups, routing, and signal/power integrity optimization.
Sensor Fusion & Multimodal AI
Real-time fusion of optical, electrical, and process sensors with adaptive control for consistent performance at scale.
Global AI Knowledge Graph
Unified learning layer that captures interconnect and packaging insights across programs to accelerate next-generation AI modules.
Applied AI Capabilities
AI copilots, digital twins, and sensor fusion powering CoWoP and advanced interconnect systems.
CoWoP Platform Architecture
AI-driven design for Chip-on-Wafer-on-Platform to shorten electrical paths, boost bandwidth density, and improve energy efficiency.
HDI/HSI Co-Optimization
40+ layer HDI and 224 Gb/s+ HSI design, simulation, and validation with AI-assisted impedance, routing, and stack-up synthesis.
AI Copilots for Integration
Autonomous AI copilots to orchestrate packaging process integration (SAP/mSAP, ABF buildup) and system bring-up.
Multimodal Sensing & Control
Closed-loop optimization with real-time sensing and adaptive control for consistent, high-volume yield in advanced packaging.
